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Three-dimensional measurement of microchips using structured light techniques

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Quiroga Mellado, Juan Antonio and Vargas, Javier and Koninckx, Thomas and Van Gool, Luc (2008) Three-dimensional measurement of microchips using structured light techniques. Optical Engineering, 47 (5). ISSN 0091-3286

Official URL: http://dx.doi.org/10.1117/1.2919726




Abstract

The industry dealing with microchip inspection requires fast, flexible, repeatable, and stable 3-D measuring systems. The typical devices used for this purpose are coordinate measurement machines (CMMs). These systems have limitations such as high cost, low measurement speed, and small quantity of measured 3-D points. Now optical techniques are beginning to replace the typical touch probes because of their noncontact nature, their full-field measurement capability, their high measurement density, as well as their low cost and high measurement speed. However, typical properties of microchip devices, which include a strongly spatially varying reflectance, make impossible the direct use of the classical optical 3-D measurement techniques. We present a 3-D measurement technique capable of optically measuring these devices using a camera-projector system. The proposed method improves the dynamic range of the imaging system through the use of a set of gray-code (GC) and phase- shift (PS) measures with different CCD integration times. A set of extended-range GC and PS images are obtained and used to acquire a dense 3-D measure of the object. We measure the 3-D shape of an integrated circuit and obtained satisfactory results.


Item Type:Article
Additional Information:

© 2008 Society of Photo-Optical Instrumentation Engineers.

Uncontrolled Keywords:Calibration, High Dynamic-Range Imaging, Active Three-Dimensional Measure, Microchip Inspection
Subjects:Sciences > Physics > Optics
ID Code:22891
Deposited On:30 Sep 2013 07:47
Last Modified:14 Oct 2013 12:01

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