Publication:
Interface quality of high-pressure reactive sputtered and atomic layer deposited titanium oxide thin films on silicon

Loading...
Thumbnail Image
Full text at PDC
Publication Date
2005
Advisors (or tutors)
Editors
Journal Title
Journal ISSN
Volume Title
Publisher
IEEE
Citations
Google Scholar
Research Projects
Organizational Units
Journal Issue
Abstract
A comparison between interface quality of several temperatures thermal annealed HPRS TiO2 films and 750 degrees C annealed ALD TiO2 films has been established. Our attention has been focused on the interfacial state and disordered induced gap state densities. From our results, HPRS films submitted to in situ 900 degrees C thermal annealing in oxygen atmosphere exhibit the best characteristics, with D-it, density being the lowest value measured in this work (5 - 6 x 10(11) cm(-2) eV(-1)), and undetectable conductance transients within our experimental limits.
Description
Spanish Conference on Electron Devices (5. 2005. Tarragona, España). © 2005 IEEE.
Unesco subjects
Keywords
Citation
[1] W. D. Brown and W. W. Grannemann, “C-V characteristics of metal-titanium dioxide-silicon capacitors”, Solid State Eleclron., vol. 21, p. 837, 1978. [2] T. Fuyuki and H. Matsunami, “Electronic properties of the interface between Si and TiOl deposited at very low temperatures”, Jpn. J. Apl. Phys., vol. 25, p. 1288, 1986. [3] N. Rausch and E. P. Burte, “Thin Ti02 films prepared by low pressure chemical vapor deposition”, J. Elecrrochem. Soc., vol. 140, p. 145, 1993. [4] J. Yan, D. C. Gilmer, S. A. Campbell, W. L. Gladfelter, and P. G. Schmid, “Structural and electrical characterization of TiO2 grown from titanium tetrakis Isopropoxide (TTIP) and TTIP/HzO ambients”, J. Vac. Sci. Technol. B, vol. 14, p. 1706, 1996. [5]S. A. Campbell, H.-S. Kim, D. C. Gilmer, E. He, T. Ma, and W. L. Gladfelter, "Titanium dioxide (TiOl)-based gate insulators”, IBMJ. Res.Develop., vol. 43, no. 3, pp. 383-392, May 1999. [6] C.D. Wilk, R.M. Wallace, and I.M. Anthony, “High-k gate dielectrics: current status and materials properties consideration”,J. Appl. Phys. vol. 89, no. 10, pp. 5243-5275, May 2001. [7] S. Monticone, R. Tufeu, A. V. Kanaev, E. Scolan, and C. Sánchez, “Quantum size effect in TiO2 nanoparticles: does it exist?”, Appl. Surf. Sci., vol. 162-163, pp. 565-570, 2000. [8] J. Pascual, J. Camassel, and H. Mathieu, “Resolved quadrupolar transition in TiO2’, Phys. Rev. Lett., vol. 39, no. 23, pp, 1490-1493, December 1977. [9] M. D. Stamate, “On the non-linear I-V characteristics of dc magnetron sputtered Ti02 thin films”, Appl. Surf. Sci., vol. 205, 99.353-357, 2003. [1O] M. Ritala, and M. Leskela, “Handbook of thin film materials, Vol. 1, Deposition and processing of thin film materials”, Academic, San Diego, p. 104,2002. [11] J. Aarik, A. Aidla, H. Mändar, and T. Uustare, “Atomic layer deposition of titanium dioxide from TiCl4 and H20: investigation of growth mechanism”, Appl. Surf. Sci., vol. 172, pp. 148-158, 2001. [12] J. Aarik, A. Aidla, V. Sammelselg, T. Uustare, M. Ritala, and M. Leskela, “Characterization of titanium dioxide atomic layer growth from titanium ethoxide and water”, Thin Solid Films, vol. 370, pp. 163-172, 2000. [13] V. Sammelselg, E. Rauhala, K. Arstila, A. Zakharov. J. Aarik, A. Kikas, J. Karlis, A. Tarre, A. Scppala, J. Asari, and I. Martinson, "Study of thin oxide films by electron, ion and synchrotron radiation beams”, Mikrochimico ACIU, vol. 139, pp. 165-169, 2002. [14] L. He, W. Hasegawa, T. Sawada, and H. Ohno, “A self consistent computer simulation of compound semiconductor MIS C-V curves based on the disorder-induced gap-state model”, J. Appl. Phys. vol. 63, no. 6, pp. 2120-2130, March 1988. [15] S. Dueñas, R. Peláez, H. Castán, R. Pinacho, L. Quintanilla, J. Barbolla, I. Mártil, and G. González-Díaz, “Experimental observation of conductance transients in AVSiN,:H/Si metal-insulator-semiconductor structures”, Appl. Phys. Lett. vol. 71, no. 6, pp. 826-828, August 1997. [16] H. Castán, S. Dueñas, J. Barbolla, E. Redondo, N. Blanco, I. Mártil, and G. González-Díaz, “Interface quality study of ECR-deposited and rapid thermal annealed silicon nitride AUSiN,:WInGaAs structures by DLTS and conductance transient techniques”, Microelectron. Rel. vol. 40, pp. 845-848, (2000).