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Electrical characterization of ECR enhaced deposited silicon nitride bilayers for high quality Al/SiNx/InP MIS structure fabrication

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Mártil de la Plaza, Ignacio and González Díaz, Germán (1999) Electrical characterization of ECR enhaced deposited silicon nitride bilayers for high quality Al/SiNx/InP MIS structure fabrication. Journal of Materials Science: Materials in Electronics, 10 (5-6). pp. 373-377. ISSN 0957-4522

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Official URL: http://dx.doi.org/10.1023/A:1008949507676


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Abstract

The interfacial state density existing in metal-insulator-semiconductor (MIS) structures was measured by deep level transient spectroscopy technique. The MIS structures were fabricated on InP substrates by direct deposition of silicon nitride (SiNxH) thin films by the electron cyclotron resonance method. In this work, we show that interfacial state density can be diminished without degrading electrical insulator properties by fabricating MIS structures based on a bi-layered insulator with different insulator compositions and different thickness. The effect of rapid thermal annealing treatment has been analysed in detail in these samples. An interface state density as low as 3x 10(11) cm(-2) eV(-1) was measured in some structures.


Item Type:Article
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© Kluwer Academic Publishers.

Uncontrolled Keywords:Cyclotron-Resonance, Films, InP, Stability, Devices, Traps.
Subjects:Sciences > Physics > Electricity
Sciences > Physics > Electronics
ID Code:26893
Deposited On:02 Oct 2014 08:46
Last Modified:10 Dec 2018 14:58

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