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Deep levels in p(+)-n junctions fabricated by rapid thermal annealing of Mg or Mg/P implanted InP

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González Díaz, Germán and Martín, J.M. and Barbolla, J. and Castán, E. and Dueñas, S. and Pinacho, R. and Quintanilla, L. (1997) Deep levels in p(+)-n junctions fabricated by rapid thermal annealing of Mg or Mg/P implanted InP. Journal of Applied Physics, 81 (7). pp. 3143-3150. ISSN 0021-8979

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Official URL: http://dx.doi.org/10.1063/1.364348


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Abstract

In this work, we investigate the deep levels present in ion implanted and rapid thermal annealed (RTA) InP p(+)-n junctions. The samples were implanted with magnesium or coimplanted with magnesium and phosphorus. These levels were characterized using deep level transient spectroscopy (DLTS) and capacitance-voltage transient technique (CVTT). Seven majority deep levels located in the upper half of the band gap were detected in the junctions by using DLTS measurements, four of which (at 0.6, 0.45, 0.425, and 0.2 eV below the conduction band) result from RTA, while the origin of the other three levels (at 0.46, 0.25, and 0.27 eV below the conduction band) can be ascribed to implantation damage. An RTA-induced origin was assigned to a minority deep level at 1.33 eV above the valence band. From CVTT measurements, several characteristics of each trap were derived. Tentative assignments have been proposed for the physical nature of all deep levels.


Item Type:Article
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© American Institute of Physics.

Uncontrolled Keywords:Chemical Vapor-Deposition, Transient Spectroscopy, Depth Profiles, Fe, Temperature, Silicon, Defects, Diodes, Growth, Traps.
Subjects:Sciences > Physics > Electricity
Sciences > Physics > Electronics
ID Code:27483
Deposited On:28 Nov 2014 10:09
Last Modified:10 Dec 2018 14:58

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