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Solderjet bumping technique used to manufacture a compact and robust green solid-state laser



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Ribes Pleguezuelo, Pol and Burkhardt, Thomas and Hornaff, M. and Kousar, S. and Burkhardt, D. and Becker, Erik and Gilaberte, Marta and Guilhot, D. and Montes, David and Galán, Miguel and Ferrando, Sergi and Laudisio, Marco and Belenguer Dávila, Tomás and Ibarmia, S. and Gallego, P. and Rodríguez, J.A. and Eberhardt, Ramona and Tünnermann, Andreas (2015) Solderjet bumping technique used to manufacture a compact and robust green solid-state laser. Proceedings of SPIE, 9520 . 6p.. ISSN 0277-786X

PDF (Proc. SPIE 9520, Integrated Photonics: Materials, Devices, and Applications III, 952009)
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Official URL: http://dx.doi.org/10.1117/12.2178373


Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation compatibility, and better heat and long term stability compared with identical glued devices. The resulting assembled compact and robust green diode-pumped solid-state laser is part of the future Raman Laser Spectrometer designed for the Exomars European Space Agency (ESA) space mission 2018.

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From Conference Volume 9520; Integrated Photonics: Materials, Devices, and Applications III. Jean-Marc Fédéli; Barcelona, Spain; May 04, 2015.
Copyright (2015) Society of Photo Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.

Uncontrolled Keywords:metallic solder; laser soldering processes; optical components; Raman Laser Spectrometer
Subjects:Sciences > Physics > Optics
Medical sciences > Optics > Optical materials
Medical sciences > Optics > Lasers
ID Code:39891
Deposited On:05 Dec 2016 10:49
Last Modified:05 Dec 2016 11:41

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