Thermally induced improvements on SiNx: H/InP devices



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Mártil de la Plaza, Ignacio and González Díaz, Germán (1999) Thermally induced improvements on SiNx: H/InP devices. Journal of vacuum science & technology a: Vacuum surfaces and films, 17 (4 - 2ª). pp. 2178-2182. ISSN 0734-2101

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The influence of rapid thermal annealing treatments on the interface characteristics of Al/SiNx:H/InP devices was analyzed. The insulator was obtained by jan electron cyclotron resonance plasma method at a 200 degrees C-deposition temperature. The films were deposited in a single deposition run but in two steps: first, we deposited the bottom layer with a film composition of x = 1.55 and then the top layer with x = 1.43. Total film thickness was 500 Angstrom in one set of samples and 200 Angstrom in the other one. Annealings were conducted in Ar atmosphere for 30 s in a temperature. range between 400 and 800 degrees C To characterize the electrical behavior of these devices, capacitance-voltage (C-V) and deep level transient spectroscopy; (DLTS) measurements-have been performed on each sample. This last characterization shows the presence of features in the spectra at E-c - 0.2 eV, E-c - 0.25 eV, E-c - 0.38 eV. The last one is due to phosphorus-vacancies, V-P. Devices with 200-Angstrom-thick insulator present the minimum interface trap densities. According to the-DLTS analysis, this minimum (2 x 10(11) cm(-2)eV(-1)) is achieved on the 400 degrees C-annealed samples, A tentative explanation of these results is given in terms: of a possible InP surface passivation due to the fact that nitrogen atoms coming from the insulator can fill phosphorus vacancies, giving rise to a low defective insulator/semiconductor interface, This process is enhanced by rapid thermal, annealing treatments at moderate temperatures (400-500 degrees C).

Item Type:Article
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International Symposium of the American-Vacuum-Society (45. 1998. Baltimore, Maryland, USA). © American Vacuum Society.

Uncontrolled Keywords:Chemical-Vapor-Deposition, Electron-Chemical-Vapor-Deposition, Electron-Cyclotron-Resonance, Insulator-Semiconductor Devices, Level Transient Spectroscopy, Plasma Method, Temperature, Dielectrics, Films, InP.
Subjects:Sciences > Physics > Electricity
Sciences > Physics > Electronics
ID Code:26965
Deposited On:02 Oct 2014 08:57
Last Modified:10 Dec 2018 14:58

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